Thermal Shock Test Chambers

SANWOOD Thermal Test System specifically designed for core components such as semiconductors, chips, and sensors. By rapidly cycling between extreme temperatures, it triggers potential failures in the shortest possible time to validate material and solder joint reliability. Meeting stringent standards like JESD22-A104 and MIL-STD, it serves as critical equipment for accelerating R&D, screening defects, and enhancing product durability.

SANWOOD Technology Two-zone Thermal Shock Test Chamber is built for products that may fail when temperature changes suddenly. Instead of changing temperature slowly in one space, the chamber uses separate hot and cold zones and transfers the sample between them to create fast thermal shock.

This test helps engineers find failures related to expansion, contraction, cracking, delamination, solder fatigue, sealing weakness, electrical instability, and material stress. As a specialized environmental test chamber, it is widely used for electronics, automotive parts, aerospace components, semiconductors, metals, plastics, rubber, coatings...

SANWOOD Technology Three-zones Thermal Shock Test Chamber is designed for rapid temperature shock testing without moving the sample. The chamber uses a high-temperature zone, a low-temperature zone, and a test zone. During testing, hot and cold airflow is switched into the test zone to create thermal shock conditions while the sample remains fixed.

This design is suitable for products that are heavy, wired, instrumented, fragile, or connected to monitoring equipment. As a specialized environmental test chamber, it helps engineers evaluate thermal stress risks such as cracking, solder fatigue, coating delamination, sealing failure, d...

SANWOOD Horizontal Thermal Shock Test Chamber is designed for thermal shock tests where sample size, weight, or fixture layout makes a compact vertical structure unsuitable. The chamber uses a horizontal transfer system to move the sample carrier between high-temperature and low-temperature zones, creating rapid hot-cold shock conditions for reliability validation.

As a specialized environmental test chamber, it helps identify failures caused by sudden expansion and contraction, including cracking, deformation, solder fatigue, insulation failure, coating delamination, seal leakage, and structural stress.

Unlike a conventiona...