Thermal Shock Test Chambers

SANWOOD Thermal Test System specifically designed for core components such as semiconductors, chips, and sensors. By rapidly cycling between extreme temperatures, it triggers potential failures in the shortest possible time to validate material and solder joint reliability. Meeting stringent standards like JESD22-A104 and MIL-STD, it serves as critical equipment for accelerating R&D, screening defects, and enhancing product durability.

Sanwood Two-Zone Thermal Shock Test Chamber is engineered to evaluate product durability through rapid and extreme temperature transitions. Featuring independent hot and cold zones with an automated transfer system, this chamber subjects test specimens to instantaneous thermal stress, identifying potential failures in materials, components, and assemblies under accelerated conditions.

Sanwood Thermal Shock Test Chamber features a unique side-to-side basket transfer system for testing heavy, fragile, or large-sized specimens. With independent hot and cold zones and horizontal lateral movement mechanism, this chamber minimizes vibration and provides smooth transfers for precision reliability testing. Ideal for automotive, aerospace, and power electronics applications.

Sanwood Three-Zone Thermal Shock Test Chamber represents the evolution of thermal stress testing with integrated hot, cold, and intermediate conditioning zones. This advanced configuration enables more controlled test processes, reduced thermal inertia effects, and the ability to perform sophisticated multi-step reliability validations in a single, automated system.