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Horizontal Thermal Shock Test Chamber

SANWOOD Horizontal Thermal Shock Test Chamber is designed for thermal shock tests where sample size, weight, or fixture layout makes a compact vertical structure unsuitable. The chamber uses a horizontal transfer system to move the sample carrier between high-temperature and low-temperature zones, creating rapid hot-cold shock conditions for reliability validation.

As a specialized environmental test chamber, it helps identify failures caused by sudden expansion and contraction, including cracking, deformation, solder fatigue, insulation failure, coating delamination, seal leakage, and structural stress.

Unlike a conventional climatic test chamber used for gradual temperature or humidity simulation, this chamber is designed for rapid hot-cold shock exposure through horizontal transfer.

Horizontal Transfer for Large-Sample Thermal Shock

A large-capacity thermal shock chamber that moves samples side-to-side between hot and cold zones for repeatable rapid temperature stress testing.

Horizontal Thermal Shock Test Chamber

Why Horizontal Transfer Matters

In large-sample testing, the transfer method is not just a mechanical detail. It affects sample loading, fixture design, test repeatability, maintenance access, and the usable size of the test area.

A horizontal structure allows the sample basket or carrier to move side-to-side between hot and cold zones. This is useful when the sample is long, wide, heavy, or mounted on a special fixture.

Practical advantages: easier loading for large parts, better support for heavy samples, more flexible fixture clearance, smoother side-to-side movement, separated hot and cold zones, and a more practical layout for batch or oversized sample testing.

Horizontal Thermal Shock Test Chamber

Thermal Shock Capability and Selection Focus

This temperature shock chamber is built for repeated hot-cold exposure, not gradual temperature ramping. Samples are held in each zone for a defined dwell time and then transferred horizontally to create rapid thermal stress.

Key selection factors: hot zone temperature, cold zone temperature, basket size, sample weight, transfer time, recovery time, dwell time, cycle count, fixture clearance, refrigeration capacity, chamber footprint, and service access.

For large or heavy samples, selection should be based on the actual load and fixture design, not only on the empty chamber temperature range.

Horizontal Thermal Shock Test Chamber

Typical Product Fit and Failure Risks

The chamber is a strong fit for products that are too large, too heavy, or too awkward for standard compact thermal shock systems. It is also useful when several samples need to be tested in one carrier.

Typical product fit: automotive modules, electronic assemblies, aerospace parts, industrial control units, battery modules, communication equipment, metal parts, plastic housings, rubber parts, coatings, adhesives, seals, and packaging materials.

Failure risks evaluated: cracking, deformation, solder joint fatigue, connector instability, coating peeling, seal leakage, material brittleness, insulation failure, and structural stress after repeated rapid temperature changes.


Horizontal Thermal Shock Test Chamber

Transfer, Control and Refrigeration Design

The chamber uses programmable control for hot zone temperature, cold zone temperature, horizontal transfer movement, dwell time, cycle count, alarms, and optional data recording. The transfer mechanism, refrigeration capacity, and airflow design must be matched to the sample size and heat load.

System features: side-to-side sample transfer, programmable touchscreen controller, adjustable dwell time and cycle count, optional RS232 / RS485 / Ethernet communication, optional PC monitoring, optional data recording, high-performance refrigeration system, optimized airflow, and safety alarms for abnormal operation.

Final configuration should be confirmed according to sample weight, carrier size, temperature range, transfer time, recovery time, cooling capacity, and installation environment.

Horizontal Thermal Shock Test Chamber

Standards, Custom Engineering and Service

The chamber can be configured to support test conditions related to IEC 60068-2-14 change of temperature, MIL-STD-810 thermal shock methods, JESD22-A106 thermal shock testing, and customer-specific reliability procedures.

Final compliance depends on the complete test method, sample type, sensor setup, calibration status, transfer time, dwell time, operating procedure, and third-party assessment.

Customization options: hot and cold zone temperature range, chamber volume, basket or carrier size, sample load, transfer structure, fixture clearance, refrigeration system, safety protection, communication and data recording, installation layout, and power supply by destination country.

SANWOOD Technology can provide model selection support, customization guidance, installation assistance, maintenance, repair, and technical service according to project requirements.



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