Memory Burn-in Test System

Sanwood Technology's Memory Burn-in Test System is specifically designed for high-low temperature aging tests on semiconductors, electronic components, and burn-in boards. It precisely simulates harsh temperature environments to ensure the reliability and stability of chips and modules prior to mass production. 

Offers non-standard customization (port expansion, specialized carriers) with full technical team support to meet stringent testing requirements such as automotive-grade standards.

• •Features high-power compressor units and efficient refrigeration systems to deliver rapid linear temperature change rates while effectively counteracting heat generated by burn-in boards, achieving precise temperature control under full-load power conditions.
• •Standard automatic electric doors enable one-touch operation with enhanced sealing, boosting efficiency while ensuring temperature field stability and personnel safety.
• •Customizable reinforced sliding-track racks are available based on client-specific BIB board and aging rack dimensions, offering high load capacity and flexible layout options.
• •Large touchscreen controllers support multi-segment programming, USB data storage/export, and optional remote monitoring/alarm functions for unattended operation.

SANWOOD Memory Burn-in Test System serves as a critical validation equipment for electronic product quality and reliability. Its core application involves conducting high-low temperature stress screening and performance evaluation under powered conditions for semiconductor devices and electronic modules mounted on dedicated burn-in boards (BIB). It primarily serves the following core sectors:

• •Semiconductor and Integrated Circuit Industry: Chip Burn-in Screening: Subjects chips such as CPUs, GPUs, memory (DRAM, NAND Flash), and microcontrollers (MCUs) to high-temperature, high-voltage powered aging to preemptively eliminate early-failure products—a critical process for enhancing factory yield rates.
• •Automotive-Grade Reliability Verification: Strictly adhering to standards like AEC-Q100, we perform high/low-temperature cycling and high-temperature reverse bias (HTRB) tests on engine control units (ECUs), battery management systems (BMS), in-vehicle sensors, IGBT modules, and more to ensure absolute reliability under extreme conditions.
• •Server and Storage Device Validation: Tests the stability of server motherboards and storage drives under prolonged high loads and temperature variations.
• •Aerospace and Defense Electronics: Performs temperature stress screening on electronic components for satellites, aviation instruments, and radar systems, far exceeding civilian standards to meet stringent requirements like MIL-STD.

Burn-in Board (Aging Board) Dedicated High-Low Temperature Test Chamber serves as the cornerstone for verifying electronic product quality and reliability, with its design and performance strictly adhering to international mainstream industry standards. Whether conducting chip aging screening, automotive-grade certification, or military product testing, this equipment delivers precise, stable, and compliant testing environments to help your products pass rigorous quality challenges.

• •Semiconductor/IC: JEDEC (JESD22) - Industry-standard reliability foundation; AEC-Q100 - Mandatory certification for automotive chips. • Automotive Electronics: AEC-Q100/Q104 - Automotive chips and modules; ISO 16750 - General environmental testing requirements for vehicle manufacturers.
• •Communication Equipment: GR-468-CORE - Core reliability standard for optical components.
• •Military/Aerospace: MIL-STD-883 / GJB 548 - High-reliability and stringent testing methods for military products.

It also complies with universal foundations: IEC 60068-2 / GB/T 2423 - International standards for high/low-temperature environmental testing.