JESD22-A104F-2020 : Sanwood Technology ESS Test Chamber Helps Semiconductors Meet Extreme Environmental Challenges

From smartphones to new energy vehicles, from 5G base stations to AI servers, semiconductor chips have become the core of modern technology. However, these chips may face harsh conditions such as extreme cold, high temperature and drastic temperature difference in the real environment. How can we ensure their long-term stable operation?

As a professional company in the field of environmental simulation test equipment, Sanwood Technology is well aware of the high reliability requirements of the semiconductor industry. Today, we will discuss the importance of JESD22-A104F-2020 temperature cycling test, and how Sanwood Technology's ESS Test Chambers can help chip companies to improve product quality.

Extreme Challenges Facing Semiconductors

Semiconductor devices are composed of various materials (such as silicon, metals, encapsulation resins, etc.), and these materials have different coefficients of thermal expansion. In real environments, semiconductor devices may be subjected to a variety of complex environmental stresses. When the temperature changes drastically, the material contraction or expansion of different degrees may lead to broken solder joints (such as BGA package ball grid array off), chip and substrate delamination, metal wire fatigue (resulting in broken circuits or increased resistance), package cracking and so on.

Requirements of international standards

JESD22-A104F-2020 is the core standard of JEDEC for temperature cycling test. Temperature cycling TCT test is a reliability test that subjects IC components to temperature conversion between extremely high and low temperatures.  During this test, the IC components are repeatedly exposed to these conditions for a specified number of cycles, and the process is required to specify the temperature change rate (℃/min) for temperature rise and fall. In addition, it is necessary to confirm whether the temperature effectively penetrates into the interior of the test sample.

Equipment Recommendation

ESS Test Chambers

Temperature range: -70℃～+180℃

Humidity range: 20%RH ~ 98%RH (+20℃ ~ +85℃)

Temperature fluctuation: ≤±0.5℃ (no load, constant state) 

Temperature deviation: ≤±2℃ (no load, constant state) 

Stress screening temperature change rate: 5℃/Min, 10℃/Min, 15℃/Min, 20℃/Min, 25℃/Min

Advanced multi-stage overlapping cold balance technology, refrigerant flow control technology effectively achieves energy saving of more than 30%.

Equipment advantages

Shorten testing cycle: Using Sanwood Technology's ESS Test Chambers for temperature cycling testing can shorten the testing cycle and accelerate product launch;

Accurate simulation of failure: By exposing potential defects (such as delamination between silicon wafers and substrates) under high stress, design optimization can be carried out in advance;

Coverage of all scenarios: Supports wide range testing from -70 ℃ to+180 ℃, meeting the needs of multiple fields such as consumer electronics, automotive, aerospace, etc.

In the era of semiconductor "involution", only products that pass stringent tests can win the market, and the environmental test chamber is the key tool to ensure their quality. Sanwood's ESS Test Chamber is not only a compliance tool, but also follows international and domestic standards, which can assist semiconductor companies to systematically verify the environmental adaptability of their products and enhance their competitiveness in the market.

Sanwood Technology has also developed  High and Low Temperature Test Chambers, Highly Accelerated Stress Test Chambers, and Thermal Chock Test Chambers, and supports customized services.

If you need to learn more about efficient testing solutions in the semiconductor field, please contact Sanwood Technology, and we will customize environmental testing solutions for you.